By A Mystery Man Writer
Design Optimization of Pillar Bump Structure for Minimizing the
Materials, Free Full-Text
Faraday Technology Corporation-WLCSP Testing & Bumping Process
Faraday Technology Corporation-WLCSP Testing & Bumping Process
Warren FLACK, Vice President, PhD
PDF) Redistribution layers (RDLs) for 2.5D/3D IC integration
Illustration of polyimide or LCP substrate and solder assembly
Polymers, Free Full-Text
Warren FLACK, Vice President, PhD
WO2018237377A1 - Curable polyimides - Google Patents
Recommended process application for the HD-8001 on 300 mm wafers
Polymers, Free Full-Text
Electromigration Performance Of Fine-Line Cu Redistribution Layer
Warren FLACK, Vice President, PhD