Details of TSFC bonding interfaces: tool/chip and bump/pad interface.

Figure 2 from Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

Figure 2 from Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

Details of TSFC bonding interfaces: tool/chip and bump/pad interface.

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

Details of TSFC bonding interfaces: tool/chip and bump/pad interface.

Figure 2 from Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface

Details of TSFC bonding interfaces: tool/chip and bump/pad interface.

PDF) Ultrasonic Vibration at Thermosonic Flip-Chip Bonding Interface