Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Impact of Annealing on the Resistivity of Ultrafine Cu Damascene Interconnects, MRS Online Proceedings Library (OPL)

Electrodeposition and characterization of copper nanocone structures

CO2 electrolysis: Advances and challenges in electrocatalyst engineering and reactor design - ScienceDirect

BJNANO - Characterization and properties of micro- and nanowires of controlled size, composition, and geometry fabricated by electrodeposition and ion-track technology

Structural Accelerating Effect of Chloride on Copper Electrodeposition

Electrodeposition and characterization of copper nanocone structures

Electrodeposition and characterization of copper nanocone structures

PDF) Thermal stresses and deformations of Cu pillar flip chip BGA package: Analyses and measurements

Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Electrodeposition of ternary Sn-Cu-Ni alloys as lead-free solders using deep eutectic solvents - ScienceDirect