Generic hybrid FPA with indium bump bonds [7].

Emerging fine-pitch bump bonding techniques - ppt video online

Analysis on Structural Stress of 64 × 64 InSb IRFPAs with

MRED simulations comparing reaction mechanisms with experimental

Christina L. Howe's research works Vanderbilt University, TN (Vander Bilt) and other places

CMOS Active Pixel Sensors

Cumulative distribution of the Cramér-Rao lower bound on the

Fabrication of indium bumps for hybrid infrared focal plane array

Fabrication of indium bumps for hybrid infrared focal plane array

Scaling infrared detectors—status and outlook - IOPscience

nBn extended short-wavelength infrared focal plane array

Hybrid UV Focal Plane Array (FPA), consisting of a back

Brian SIERAWSKI, Research Associate Professor, PhD Electrical Engineering, Vanderbilt University, TN, Vander Bilt, Institute for Space and Defence Electronics

Pixel-level plasmonic microcavity infrared photodetector

Marcus H. Mendenhall's research works National Institute of Standards and Technology (NIST) and other places