Flip Chip Bump Technology: Au Stud

Solder bumps versus Au bumps SAC305 solder has been included as a Bump Technology, as this tends to be the most common solder bump material. However, other common solder bump options such as SnPb, have similar thermal, electrical and mechanical properties. Table 5 below provides a summary of the thermal, mechanical and electrical comparison of […]

Gold Stud - Double Bump Bonding

Conductive Adhesives for Flip-Chip Applications

Space and HI-REL Assembly Alter Technology (formerly Optocap)

Gold Ball Bumping Factors and Benefits

Assessment of Au Stud-Solder Interconnection for Fine Pitch Flip

Illustration of double bump flip-chip process.

Vibration Tests Types and flow on HI-ReL EEE Parts

Scanning electron microscopy of: (a) Au stud bumps formed on Al

Flip Chip - Semiconductor Packaging and Assembly

PDF) Study of Interconnection Process for Fine Pitch Flip Chip