Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds

Bulk Thermal Conductivity vs. Thermal Impedence

Enhancing Thermal Conductivity of hBN/SiC/PTFE Composites with Low Dielectric Properties via Pulse Vibration Molding - Feng - 2023 - Macromolecular Rapid Communications - Wiley Online Library

Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si3N4 filler with randomly oriented grains

Composite molding compound replaces Invar for lightweight small satellite structures

Evolution of epoxy molding compounds and future carbon materials

High thermal conductivity of boron nitride filled epoxy composites

Tunable negative thermal expansion in La(Fe, Si)13/resin

P-V-T-C equation for epoxy molding compound

Polymers, Free Full-Text

Preparation and properties of high-performance polyethersulfone composites reinforced by modified silicon nitride - Zhongming Dai, Shiyang Zhu, Shanyou Liu, Shaowei Guan, 2012

Thermal Conductivity Archives

Negative thermal expansion patented technology retrieval search results - Eureka

Thermal Analysis in Advanced Packaging Materials iST - Decoding Thermal Characteristics in Advanced Packaging Materials

pub.mdpi-res.com/polymers/polymers-14-02200/articl

low CTE epoxies, Epoxies with Low Coefficient of Thermal Expansion, epoxy resistant to automotive chemicals, 3D printer nozzles epoxy compound - - Molding compounds, Epoxy molding compounds, Thermoset Molding compounds, Hysol Molding