Bonding Pad Design Ⅱ

By A Mystery Man Writer

Cylindrical component bonding pad design - The shape of bonding pad is rectangle. When the reflow soldering process is applied, a concave groove must be designed

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Bonding Pad Design Ⅱ

Wirebond Physical Implementation

Layout design on bond pads to improve the firmness of bond wire in packaged IC products

Bonding Pad

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Design guide - Mandalon EN

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Bonding Pad Design Ⅱ

Capillary Orbray Co., Ltd.

Printed Circuit Board Panel Design