A study of thermal cycling and radiation effects on indium and

The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere [1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless solder bump-bonded dummy detectors through a thermal cycle and then a dose of radiation to observe the effects of cooling, heating and radiation on bump-bonds. We also exercised the processes of HDI mounting and wire bonding to some of the dummy detectors to see the effect of these processes on bump bonds.

Tailoring lithium concentration in alloy anodes for long cycling

Why separation is needed in pharmaceutical multiple component

PDF] Characterization of indium and solder bump bonding for pixel detectors

Delafosse CHRISTIAN, Medical Doctor, Hospital Simone Veil, Montmorency, department of pneumology

Use of CCD for reflow process design

Applied Sciences, Free Full-Text

REHVA Journal Thermal impact of street canyon microclimate on the

AIT Dummy Detector Bump Daisy Chain.

HgCdTe Detector Chip Technology

High thermal conductivity in indium-based metal/diamond composites

A dual-mode textile for human body radiative heating and cooling

Fermin REYGADAS, Executive Director, PhD

Stud bumping for flip chip - An alternate strategy

Efficient semiconductor thermal management - News

Pushing the boundaries of photovoltaic (PV) technology