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Second cycle of stitch bond parameter optimization
Die attachment, wire bonding, and encapsulation process in LED
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Ball bond shear strength versus ultrasound for (a) Au, (b) Cu-H
Illustration of non-stick event. (a) Crescent bonding deforms wire
Defective crescent bonds. (a) Lift off. (b) Excessive wire
Young-Kyu Song's research works
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